电阻基于SMT技术的,称为SMT电阻器,该电阻是SMD家族或表面安装设备家族的成员之一。
By: S. Prakash
这electronic equipment of various types such as televisions, commercial communication equipment, cell phones, research equipment of high technology and MP3 player uses the SMD resistors.
SMD电阻的基本结构
SMD电阻的形状是矩形。
这re is a presence of a metallized area in the chip resistors at any one side of their body which in turn enables the contact of the printed circuit board with the chip resistor by using the solder.
陶瓷底物是电阻器的组件之一,金属氧化物膜沉积在其上方。这resistance of the resistor取决于实际胶片的长度和厚度。
Since metal oxide is used to manufacture the SMD resistors which enable the resistor to be highly stable along with the tolerance level also being high. The element with which a ceramic substrate is made up of is high alumina ceramic.
使用高铝陶瓷SMD resistors provide stable insulation on the basis of the resistive metal oxide element on which the resistor is set down.
SMD电阻的终止也很重要。
SMD电阻与芯片电阻器的电阻元件需要进行的接触需要可靠,同时它应该提供很高的焊接性。
通过使用基于镍的层来建立内部连接,可以实现此类高水平。同时,基于锡的外层用于使外部连接实现非常高的焊接性。
Packages of SMD Resistors
这re are variety of different packages in which the SMD (Surface mount resistors) come. The size in which the packages of the chip resistors come has decreased significantly because of the advancement of the technology over a period of time.
SMD电阻的规格
有很多公司参与SMD电阻的制造。因此,SMD电阻的规格根据制造商提供的规格而有所不同。
因此,在确定SMD电阻的需求时,需要检查给定SMD电阻的制造商的额定值。同时,人们可以预期一般级别的评级。
Power Rating: Due consideration needs to be provided to the power rating in a given design.
与使用电线端部件的电路设计相比,使用SMD电阻器的设计的功率水平非常小。
公差:将金属氧化物膜用于制造的表面固定电阻的公差值非常接近。
大规模可用的公差水平包括1%,5%和2%。此外,对于专业应用程序,可以实现0.1%和0.5%的值。
Temperature Coefficient: The temperature coefficient values of the Surface Mount Resistors which use the metal oxide film for their manufacturing is very high.
这temperature coefficients levels which are available at a large scale include 100 ppm/C and 25,50 ppm/C.
Applications of SMD Resistors
在各种设计中,都可以使用表面固定电阻。
SMD电阻的大小使它们具有各种优势,例如:它们可用于自动组件的技术;在无线电频率下提供高性能;以及对本质上紧凑的电路板的高适合性。
SMD电阻器的电容和电感由于其大小而在本质上是虚假的。因此,在计算SMD电阻的功率耗散时,需要小心,因为耗散的功率水平非常低。
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For power SMD devices I would recommend using a double sidedPCB with wide tinned copper area under the device over which the device is required to be soldered. the hind side of the PCB could be then suitably attached to a heatsink or an aluminum plate.
I think a PCB designer will know much better than me, so you can consult a professional PCB designer for knowing more about this.